Companies, Universities & Research Institutes Interested in Integrated Photonics are Encouraged to Participate

The IPSR-I is a living document that is continuously updated. The chapters need enrichment with technological, module and application developments in their respective fields. A call is always open for contributions by experts in the various technological and applicational fields to update the IPSR-I. The Integrated Photonic Systems Roadmap International (IPSR-I) invites all organizations, including universities, research institutes, SMEs, customers and the vertical supply chain to participate. 

Participation and attendance at all IPSR-I meetings is by invitation, but all stakeholders who are willing to devote time and effort to achieve the goals of IPSR-I are encouraged to participate.

There are two ways to participate:

1.     Join one of the working groups. List of WG’s and WGL below. sent an e-mail to p.vanarkel@berenschot.nl and cwjames@mit.edu

2.     Attend IPSR-I workshops by registering on the IPSR-I website and requesting an invitation to the meeting

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Working GroupsTopicsCo chairCo chairCo chair
Data/Tele IcTData Center/TelecomMichael Robertson (Huawei)Michael Lebby (Lightwave Logic) 
SensorsIoT & Industrial equipmentChristophe Py (CNRC)Rich Grzybowski (Macom) 
Automotive   
AerospaceRolf Evenbleij (Technobis)Amin Abassi (Antwerpspace)David Mackey (MBryonics)
HealthcareThierry Robin (Thematys)Anu Agarwal (MIT) 
Photonic ModulesRF PhotonicsArthur Paolella (Harris)Guillermo Carpintero (University Carlos III of Madrid) 
Integrated Photonic SensorsBen Miller (U of Rochester)Anu Agarwal (MIT) 
IPSR Cost Emulators Randolph Kirchain (MIT) 
Electronic Photonic Design AutomationTwan Korthorst (Synopsis / Phoenix)Tom Daspit (Mentor) 
Front-endMonolithic Silicon IntegrationAbdul Rahim / Roel Baets (ePixfab)Lionel Kimerling (MIT)Ajey Jacob
InP & III-V compoundsMike Wale (TU/e)Gloria Hoefler (Infinera) 
SiNSami Musa (Vision & actions)Lionel Kimerling (MIT) 
PolymersFelix Betschon (Vario optics)Michael Lebby (Lightwave Logic) 
Back-endPackagingPeter ‘O Brien (Tyndall)Bill Bottoms (3MTS) 
InterconnectsPeter Maat (Astron)Terry SmithJohn MacWilliams
AssemblyPaul van Dijk (LioniX-International)Yi Quan (MRSI Systems)Dick Otte (Promex Industries)
TestingSylwester Latkowski (TU/e)Dave Armstrong (Advantest)Tom Brown (U of Rochester)