Companies, Universities & Research Institutes Interested in Integrated Photonics are Encouraged to Participate
The IPSR-I is a living document that is continuously updated. The chapters need enrichment with technological, module and application developments in their respective fields. A call is always open for contributions by experts in the various technological and applicational fields to update the IPSR-I. The Integrated Photonic Systems Roadmap International (IPSR-I) invites all organizations, including universities, research institutes, SMEs, customers and the vertical supply chain to participate.
Participation and attendance at all IPSR-I meetings is by invitation, but all stakeholders who are willing to devote time and effort to achieve the goals of IPSR-I are encouraged to participate.
There are two ways to participate:
1. Join one of the working groups. List of WG’s and WGL below. sent an e-mail to p.vanarkel@berenschot.nl and cwjames@mit.edu
2. Attend IPSR-I workshops by registering on the IPSR-I website and requesting an invitation to the meeting

Working Groups | Topics | Co chair | Co chair | Co chair |
Data/Tele IcT | Data Center/Telecom | Michael Robertson (Huawei) | Michael Lebby (Lightwave Logic) | |
Sensors | IoT & Industrial equipment | Christophe Py (CNRC) | Rich Grzybowski (Macom) | |
Automotive | ||||
Aerospace | Rolf Evenbleij (Technobis) | Amin Abassi (Antwerpspace) | David Mackey (MBryonics) | |
Healthcare | Thierry Robin (Thematys) | Anu Agarwal (MIT) | ||
Photonic Modules | RF Photonics | Arthur Paolella (Harris) | Guillermo Carpintero (University Carlos III of Madrid) | |
Integrated Photonic Sensors | Ben Miller (U of Rochester) | Anu Agarwal (MIT) | ||
IPSR Cost Emulators | Randolph Kirchain (MIT) | |||
Electronic Photonic Design Automation | Twan Korthorst (Synopsis / Phoenix) | Tom Daspit (Mentor) | ||
Front-end | Monolithic Silicon Integration | Abdul Rahim / Roel Baets (ePixfab) | Lionel Kimerling (MIT) | Ajey Jacob |
InP & III-V compounds | Mike Wale (TU/e) | Gloria Hoefler (Infinera) | ||
SiN | Sami Musa (Vision & actions) | Lionel Kimerling (MIT) | ||
Polymers | Felix Betschon (Vario optics) | Michael Lebby (Lightwave Logic) | ||
Back-end | Packaging | Peter ‘O Brien (Tyndall) | Bill Bottoms (3MTS) | |
Interconnects | Peter Maat (Astron) | Terry Smith | John MacWilliams | |
Assembly | Paul van Dijk (LioniX-International) | Yi Quan (MRSI Systems) | Dick Otte (Promex Industries) | |
Testing | Sylwester Latkowski (TU/e) | Dave Armstrong (Advantest) | Tom Brown (U of Rochester) |